Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate
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United States of America Patent
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Jul 28, 1992
Issued Date -
N/A
app pub date -
Jul 9, 1991
filing date -
Aug 27, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flexible film is made into a substrate (100) having metallization patterns. A semiconductor device (106) is affixed to the substrate, and the assembly is heated to expand the substrate. A cover (110) is attached to the substrate, over the device (106). Upon cooling, the substrate (100) shrinks and becomes taut and planar within the reinforced area. Alternatively, a reinforcing ring (210) can be attached to the substrate (200) either before or after attachment of the semiconductor device (206).
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