Electroplating method
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United States of America Patent
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-
Aug 4, 1992
Issued Date -
N/A
app pub date -
Sep 19, 1991
filing date -
Oct 12, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plating rack for use in electroplating at least one substrate includes a rack body onto which the substrate may be placed; a metal ring connected to the rack body so as to surround a substrate placed on the rack body; and bistable, single-tipped cam assemblies for holding a placed substrate in place and for making electrical contact between the metal ring and the substrate.
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