Partially coated assembly structure and method for making a ceramic lid for hermetic sealing of an eprom circuit
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United States of America Patent
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-
Aug 11, 1992
Grant Date -
N/A
app pub date -
Aug 29, 1990
filing date -
Aug 29, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A partially coated assembly structure and a method for making a ceramic lid for a hermetically sealed package for an EPROM circuit are disclosed. The assembly structure includes, in combination, a ceramic lid, a UV transparent lens, and two fixtures for supporting the lens in the lid. The two fixtures are coated with a non-lens wetting film in predetermined areas where contact is made between the fixtures and the lens, and between the fixtures and the lid. The UV transparent lens is hermetically sealed to the ceramic lid by firing the assembly structure. The assembly structure prevents the lens from attracting foreign particulate matter during firing, thereby leaving the surfaces of the lens clean. The method provides a ceramic lid having a UV transparent lens hermetically sealed thereto, which finds wide use in integrated circuit packages for high-density EPROM's because of the untainted surfaces of the lens.
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