Importance

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Abstract

A method of manufacturing a repairable multi-chip module including providing a plurality of tape automated bonded chips secured to a corresponding number of substrates by a first bonding material. A second bonding material having a melting point below that of the first bonding material is used to mechanically attach the substrates to a multi-chip package. However, the second bonding material is not melted until after all of the chips have been properly tested. Electrical attachment is provided prior to mechanical attachment by bonding leads of the tape automated bonding frame to the multi-chip module. Removing a defective chip requires only the detachment of the leads. A replacement chip and a replacement substrate are then inserted in the position previously maintained by the defective chip. After the entire module is tested positively, the second bonding material is melted to mechanically attach the substrates to the module. Hermetical sealing of the module is also by means of the second bonding material.

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First Claim