Packaging for semiconductor logic devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Aug 11, 1992
Grant Date -
N/A
app pub date -
Jan 22, 1991
filing date -
Jan 22, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A logic module design is disclosed which incorporates an unencapsulated wafer section or sections. The disclosed module is an improvement over previous designs in that it is less expensive and easier to manufacture due to the reduced number of components and the complexity of the components, is faster and consumes less power because of its shorter trace lengths and smaller size, and is more reliable as a result of its greatly reduced number of interconnects.
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