Non-contaminating wafer polishing slurry
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United States of America Patent
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Aug 18, 1992
Grant Date -
N/A
app pub date -
Apr 24, 1991
filing date -
Apr 24, 1991
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A semiconductor wafer polishing slurry that does not contaminate a wafer processing area utilizes an aqueous organic base to suspend the slurry's fine abrasive particles. The organic base has large cations (13,16,19) that do not diffuse into semiconductor wafers. Therefore ionic contamination from the polishing slurry is substantially eliminated.
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