Importance

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Abstract

A method for mounting electronic components, such as capacitors and the like, to a flat flexible insulating substrate having conductive material thereon. In one form of the invention, an electronic component is attached to a given area of the substrate with one conductive side of the electronic component in electrical connection with the conductive material on the substrate. A slot is formed in the substrate substantially about the electronic component but less than 360.degree. thereabout to define a tongue, including the electronic component, and an integral hinge portion of the substrate. The tongue is bent about the integral hinge portion to move the tongue out of the plane of the substrate and thereby move the electronic component therewith into a desired position for connection of an opposite conductive side of the electronic component to an appropriate terminal. In another form of the invention, a closed or 360.degree. slot is formed in the substrate. One conductive side of the electronic component is in electrical connection with the conductive material on the substrate within the closed slot, and the other conductive side of the electronic component is in electrical connection with the conductive material on the substrate outside the closed slot. A terminal is electrically connected to the conductive material on the substrate inside the closed slot.

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First Claim