Stripping method for removing resist from a printed circuit board
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United States of America Patent
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-
Sep 8, 1992
Issued Date -
N/A
app pub date -
Jun 20, 1990
filing date -
Jan 31, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A stripping method is provided to remove processed photoresist images from printed circuit substrates without damage to underlying high density circuitry. A solid particulate blast process is used to remove the resist images wherein the polymeric particles having a Mho hardness in the range from 2.0 to 4.0 are used as the blast media.
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Cited Art Landscape
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