Interconnection structure and test method
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United States of America Patent
Stats
-
Sep 15, 1992
Issued Date -
N/A
app pub date -
Aug 9, 1991
filing date -
Jul 18, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.
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Cited Art Landscape
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