Electrolessly solder plating composition
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United States of America Patent
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Sep 15, 1992
Grant Date -
N/A
app pub date -
Jan 17, 1990
filing date -
Jan 24, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention provides a bath composition for electroless solder plating comprising: (A) about 5 to about 120 g/l of at least one compound selected from the group consisting of alkanesulfonic acids and alkanolsulfonic acids, (B) about 10 to about 100 g/l of at least one compound selected from the group consisting of tin salts of alkanesulfonic acids and tin salts of alkanolsulfonic acids, (C) about 10 to about 100 g/l of at least one compound selected from the group consisting of lead salts of alkanesulfonic acids and lead salts of alkanolsulfonic acids, (D) about 10 to about 200 g/l of at least one compound selected from the group consisting of thiourea and thiourea derivatives, and (E) about 1 to about 250 g/l of at least one compound selected from the group consisting of monocarboxylic acids, dicarboxylic acids, tricarboxylic acids and salts thereof.
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