Method for fabricating a multichip semiconductor device having two interdigitated leadframes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 15, 1992
Issued Date -
N/A
app pub date -
Mar 1, 1991
filing date -
May 14, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A packaged semiconductor device is disclosed having at least two electronic components encapsulated in a single body of standard size and pin-out configuration. In accordance with one embodiment of this invention, two leadframes, having electronic components electrically coupled thereto, are positioned such that the electronic components are in a stacked relationship and the outer portions of the two sets of leads within each leadframe are interdigitated. The configuration enables all components to be accessed independently and minimizes the footprint of the device while maintaining a standard package outline.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully