Plasma processing method for improving a package of a semiconductor device

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United States of America Patent

PATENT NO 5147822
SERIAL NO

07667231

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Abstract

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An electronic device comprising a substrate having a frame, a metal lead and electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR ENERGY LABORATORY CO LTDKANAGAWA KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hayashi, Shigenori Atsugi, JP 85 3991
Hirose, Naoki Atsugi, JP 48 1792
Imatou, Shinji Atsugi, JP 11 243
Ishida, Noriya Atsugi, JP 14 240
Koyama, Itaru Hatano, JP 10 170
Sasaki, Mari Atsugi, JP 20 199
Tsuchiya, Mitsunori Atsugi, JP 12 226
Urata, Kazuo Atsugi, JP 23 336
Wada, Kouhei Atsugi, JP 7 100
Yamazaki, Shunpei Tokyo, JP 7534 239327

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