US Patent No: 5,148,266

Number of patents in Portfolio can not be more than 2000

Semiconductor chip assemblies having interposer and flexible lead

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Abstract

A semiconductor chip assembly is mounted to contact pads in a compact area array. An interposer is disposed between the chip and the substrate. The contacts on the chip are connected to terminals on the interposer by flexible leads extending through apertures in the interposer. The terminals on the interposer in turn are bonded to the contact pads on the substrate. Flexibility of the leads permits relative movement of the contacts on the chip relative to the terminals and the contact pads of the substrate and hence relieves the stresses caused by differential thermal expansion. The arrangement provides a compact structure similar to that achieved through flip-chip bonding, but with markedly increased resistance to thermal cycling damage.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TESSERA, INC.SAN JOSE, CA557

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DiStefano, Thomas H Monte Sereno, CA 193 9077
Khandros, Igor Y Orinda, CA 238 13648

Cited Art

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (5)
4,545,610 Method for forming elongated solder connections between a semiconductor device and a supporting substrate 271 1983
4,604,644 Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making 229 1985
4,811,082 High performance integrated circuit packaging structure 259 1986
4,796,078 Peripheral/area wire bonding technique 141 1987
4,855,867 Full panel electronic packaging structure 50 1988
 
MITSUBISHI DENKI KABUSHIKI KAISHA (2)
4,941,033 Semiconductor integrated circuit device 70 1989
4,967,261 Tape carrier for assembling an IC chip on a substrate 59 1989
 
SGS-THOMSON MICROELECTRONICS, INC. (2)
4,627,151 Automatic assembly of integrated circuits 57 1984
4,685,998 Process of forming integrated circuits with contact pads in a standard array 140 1986
 
BELL TELEPHONE LABORATORIES, INCORPORATED (1)
4,670,770 Integrated circuit chip-and-substrate assembly 143 1984
 
CIRCUIT COMPONENTS, INCORPORATED (1)
4,793,814 Electrical circuit board interconnect 254 1986
 
CITIZEN WATCH CO., LTD. (1)
4,237,607 Method of assembling semiconductor integrated circuit 51 1978
 
FREESCALE SEMICONDUCTOR, INC. (1)
4,989,069 Semiconductor package having leads that break-away from supports 60 1990
 
FUJITSU LIMITED (1)
4,751,482 Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection 70 1986
 
INTEL CORPORATION (1)
4,574,470 Semiconductor chip mounting system 32 1984
 
KABUSHIKI KAISHA TOSHIBA (1)
4,878,098 Semiconductor integrated circuit device 46 1989
 
LOCKHEED MARTIN CORPORATION (1)
4,884,122 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer 92 1988
 
MAXIM INTEGRATED PRODUCTS, INC. (1)
4,628,406 Method of packaging integrated circuit chips, and integrated circuit package 70 1985
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
4,751,199 Process of forming a compliant lead frame for array-type semiconductor packages 106 1987
 
NEC CORPORATION (1)
4,874,721 Method of manufacturing a multichip package with increased adhesive strength 61 1988
 
NORTEL NETWORKS CORPORATION (1)
4,814,295 Mounting of semiconductor chips on a plastic substrate 84 1986
 
NORTEL NETWORKS LIMITED (1)
4,710,798 Integrated circuit chip package 120 1985
 
OLIN CORPORATION (1)
4,721,993 Interconnect tape for use in tape automated bonding 44 1986
 
TEXAS INSTRUMENTS INCORPORATED (1)
4,709,468 Method for producing an integrated circuit product having a polyimide film interconnection structure 83 1986
 
U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE (1)
4,681,654 Flexible film semiconductor chip carrier 86 1986

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
TESSERA, INC. (269)
5,414,298 Semiconductor chip assemblies and components with pressure contact 86 1993
5,679,977 Semiconductor chip assemblies, methods of making same and components for same 194 1993
5,398,863 Shaped lead structure and method 99 1993
5,548,091 Semiconductor chip connection components with adhesives and methods for bonding to the chip 85 1993
5,455,390 Microelectronics unit mounting with multiple lead bonding 176 1994
5,663,106 Method of encapsulating die and chip carrier 109 1994
5,489,749 Semiconductor connection components and method with releasable lead support 108 1994
5,491,302 Microelectronic bonding with lead motion 86 1994
5,536,909 Semiconductor connection components and methods with releasable lead support 91 1994
5,929,517 Compliant integrated circuit package and method of fabricating the same 63 1994
5,659,952 Method of fabricating compliant interface for semiconductor chip 222 1994
5,801,446 Microelectronic connections with solid core joining units 57 1995
5,915,752 Method of making connections to a semiconductor chip assembly 55 1995
5,794,330 Microelectronics unit mounting with multiple lead bonding 25 1995
5,787,581 Methods of making semiconductor connection components with releasable load support 33 1995
5,798,286 Connecting multiple microelectronic elements with lead deformation 67 1995
5,766,987 Microelectronic encapsulation methods and equipment 61 1995
5,619,017 Microelectronic bonding with lead motion 27 1995
5,834,339 Methods for providing void-free layers for semiconductor assemblies 82 1996
6,001,671 Methods for manufacturing a semiconductor package having a sacrificial layer 379 1996
5,808,874 Microelectronic connections with liquid conductive elements 63 1996
5,875,545 Method of mounting a connection component on a semiconductor chip with adhesives 31 1996
5,830,782 Microelectronic element bonding with deformation of leads in rows 57 1996
6,359,236 Mounting component with leads having polymeric strips 22 1996
5,861,666 Stacked chip assembly 233 1996
6,020,220 Compliant semiconductor chip assemblies and methods of making same 81 1996
5,821,608 Laterally situated stress/strain relieving lead for a semiconductor chip package 31 1996
6,329,607 Microelectronic lead structures with dielectric layers 25 1996
5,776,796 Method of encapsulating a semiconductor package 86 1996
6,081,035 Microelectronic bond ribbon design 30 1996
6,211,572 Semiconductor chip package with fan-in leads 75 1996
6,075,289 Thermally enhanced packaged semiconductor assemblies 98 1996
5,971,253 Microelectronic component mounting with deformable shell terminals 52 1996
5,706,174 Compliant microelectrionic mounting device 76 1997
6,133,639 Compliant interface for semiconductor chip and method therefor 39 1997
5,950,304 Methods of making semiconductor chip assemblies 82 1997
6,030,856 Bondable compliant pads for packaging of a semiconductor chip and method therefor 51 1997
6,177,636 Connection components with posts 58 1997
5,915,170 Multiple part compliant interface for packaging of a semiconductor chip and method therefor 52 1997
6,265,765 Fan-out semiconductor chip assembly 30 1997
6,012,224 Method of forming compliant microelectronic mounting device 119 1997
6,202,298 Microelectronic connections with liquid conductive elements 21 1997
6,046,076 Vacuum dispense method for dispensing an encapsulant and machine therefor 54 1997
6,002,168 Microelectronic component with rigid interposer 43 1997
6,133,627 Semiconductor chip package with center contacts 36 1997
6,130,116 Method of encapsulating a microelectronic assembly utilizing a barrier 52 1997
6,460,245 Method of fabricating semiconductor chip assemblies 18 1997
6,266,872 Method for making a connection component for a semiconductor chip package 4 1997
6,133,072 Microelectronic connector with planar elastomer sockets 60 1997
6,121,676 Stacked microelectronic assembly and method therefor 161 1997
6,417,029 Compliant package with conductive elastomeric posts 14 1997
6,083,837 Fabrication of components by coining 28 1997
6,054,337 Method of making a compliant multichip package 55 1997
5,989,936 Microelectronic assembly fabrication with terminal formation from a conductive layer 59 1997
5,989,939 Process of manufacturing compliant wirebond packages 33 1997
5,932,254 System for encapsulating microelectronic devices 19 1998
6,049,972 Universal unit strip/carrier frame assembly and methods 37 1998
5,885,849 Methods of making microelectronic assemblies 74 1998
6,583,444 Semiconductor packages having light-sensitive chips 91 1998
6,182,546 Apparatus and methods for separating microelectronic packages from a common substrate 7 1998
6,324,754 Method for fabricating microelectronic assemblies 39 1998
6,096,574 Methods of making microelectronic corrections with liquid conductive elements 28 1998
6,365,975 Chip with internal signal routing in external element 77 1998
5,977,618 Semiconductor connection components and methods with releasable lead support 16 1998
5,959,354 Connection components with rows of lead bond sections 25 1998
6,080,932 Semiconductor package assemblies with moisture vents 41 1998
6,232,152 Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures 57 1998
6,114,763 Semiconductor package with translator for connection to an external substrate 46 1998
5,994,781 Semiconductor chip package with dual layer terminal and lead structure 36 1998
5,951,305 Lidless socket and method of making same 88 1998
6,492,201 Forming microelectronic connection components by electrophoretic deposition 47 1998
6,266,874 Methods of making microelectronic components having electrophoretically deposited layers 30 1998
6,265,759 Laterally situated stress/strain relieving lead for a semiconductor chip package 15 1998
6,392,306 Semiconductor chip assembly with anisotropic conductive adhesive connections 40 1998
6,104,087 Microelectronic assemblies with multiple leads 40 1998
6,228,686 Method of fabricating a microelectronic assembly using sheets with gaps to define lead regions 39 1998
6,335,222 Microelectronic packages with solder interconnections 7 1998
6,045,655 Method of mounting a connection component on a semiconductor chip with adhesives 25 1998
6,228,685 Framed sheet processing 24 1998
6,217,972 Enhancements in framed sheet processing 24 1998
6,107,123 Methods for providing void-free layers for semiconductor assemblies 20 1998
6,202,299 Semiconductor chip connection components with adhesives and methods of making same 13 1998
6,126,428 Vacuum dispense apparatus for dispensing an encapsulant 50 1999
6,468,830 Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor 7 1999
6,303,408 Microelectronic assemblies with composite conductive elements 7 1999
6,309,915 Semiconductor chip package with expander ring and method of making same 41 1999
6,169,328 Semiconductor chip assembly 62 1999
6,334,942 Selective removal of dielectric materials and plating process using same 5 1999
6,117,694 Flexible lead structures and methods of making same 72 1999
6,054,756 Connection components with frangible leads and bus 47 1999
6,429,112 Multi-layer substrates and fabrication processes 24 1999
6,329,605 Components with conductive solder mask layers 44 1999
6,196,042 Coining tool and process of manufacturing same for making connection components 3 1999
6,197,665 Lamination machine and method to laminate a coverlay to a microelectronic package 7 1999
6,300,254 Methods of making compliant interfaces and microelectronic packages using same 6 1999
6,238,938 Methods of making microelectronic connections with liquid conductive elements 10 1999
6,603,209 Compliant integrated circuit package 41 1999
6,191,473 Bonding lead structure with enhanced encapsulation 4 1999
6,361,959 Microelectronic unit forming methods and materials 32 1999
6,272,744 Semiconductor connection components and methods with releasable lead support 7 1999
6,218,213 Microelectronic components with frangible lead sections 0 1999
6,204,455 Microelectronic component mounting with deformable shell terminals 41 1999
6,126,455 Lidless socket and method of making same 4 1999
6,214,640 Method of manufacturing a plurality of semiconductor packages 39 1999
6,248,656 Metal-jacketed lead manufacturing process using resist layers 3 1999
6,373,141 Bondable compliant pads for packaging of a semiconductor chip and method therefor 18 1999
6,354,485 Thermally enhanced packaged semiconductor assemblies 14 1999
6,107,682 Compliant wirebond packages having wire loop 5 1999
6,420,661 Connector element for connecting microelectronic elements 36 1999
6,372,527 Methods of making semiconductor chip assemblies 43 1999
6,307,260 Microelectronic assembly fabrication with terminal formation from a conductive layer 26 1999
6,306,752 Connection component and method of making same 22 1999
6,370,032 Compliant microelectronic mounting device 19 1999
6,499,216 Methods and structures for electronic probing arrays 53 1999
6,208,025 Microelectronic component with rigid interposer 12 1999
6,221,750 Fabrication of deformable leads of microelectronic elements 36 1999
6,170,151 Universal unit strip/carrier frame assembly and methods 4 1999
6,252,301 Compliant semiconductor chip assemblies and methods of making same 30 1999
6,433,419 Face-up semiconductor chip assemblies 37 2000
6,184,140 Methods of making microelectronic packages utilizing coining 0 2000
6,147,401 Compliant multichip package 60 2000
6,204,091 Method of assembling a semiconductor chip package 18 2000
6,525,429 Methods of making microelectronic assemblies including compliant interfaces 34 2000
6,486,003 Expandable interposer for a microelectronic package and method therefor 16 2000
6,651,321 Microelectronic joining processes 12 2000
6,543,131 Microelectronic joining processes with temporary securement 16 2000
6,492,251 Microelectronic joining processes with bonding material application 35 2000
6,468,836 Laterally situated stress/strain relieving lead for a semiconductor chip package 23 2000
6,557,253 Method of making components with releasable leads 8 2000
6,423,907 Components with releasable leads 10 2000
6,358,780 Semiconductor package assemblies with moisture vents and methods of making same 19 2000
6,541,867 Microelectronic connector with planar elastomer sockets 14 2000
6,493,932 Lidless socket and method of making same 9 2000
6,687,980 Apparatus for processing flexible tape for microelectronic assemblies 1 2000
6,675,469 Vapor phase connection techniques 6 2000
6,458,681 Method for providing void free layer for semiconductor assemblies 17 2000
6,635,514 Compliant package with conductive elastomeric posts 6 2000
6,380,060 Off-center solder ball attach and methods therefor 8 2000
6,274,820 Electrical connections with deformable contacts 19 2000
7,198,969 Semiconductor chip assemblies, methods of making same and components for same 17 2000
6,521,480 Method for making a semiconductor chip package 26 2000
6,338,982 Enhancements in framed sheet processing 14 2000
6,687,842 Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element 18 2000
6,465,893 Stacked chip assembly 105 2000
6,826,827 Forming conductive posts by selective removal of conductive material 27 2000
6,359,335 Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures 41 2000
6,518,662 Method of assembling a semiconductor chip package 23 2000
6,437,240 Microelectronic connections with liquid conductive elements 25 2001
6,848,173 Microelectric packages having deformed bonded leads and methods therefor 32 2001
6,573,609 Microelectronic component with rigid interposer 24 2001
6,465,878 Compliant microelectronic assemblies 22 2001
6,541,852 Framed sheets 12 2001
6,906,422 Microelectronic elements with deformable leads 3 2001
6,586,955 Methods and structures for electronic probing arrays 40 2001
6,486,547 Microelectronic assembly incorporating lead regions defined by gaps in a polymeric sheet 15 2001
6,794,202 Assemblies for temporarily connecting microelectronic elements for testing and methods therefor 0 2001
6,632,733 Components and methods with nested leads 5 2001
6,664,621 Semiconductor chip package with interconnect structure 8 2001
7,078,819 Microelectronic packages with elongated solder interconnections 2 2001
6,570,101 Lead configurations 13 2001
6,686,015 Transferable resilient element for packaging of a semiconductor chip and method therefor 15 2001
6,849,953 Microelectronic assemblies with composite conductive elements 5 2001
7,427,423 Components with conductive solder mask layers 6 2001
6,758,984 Selective removal of dielectric materials and plating process using same 0 2001
6,388,340 Compliant semiconductor chip package with fan-out leads and method of making same 19 2001
6,465,747 Microelectronic assemblies having solder-wettable pads and conductive elements 14 2001
6,534,392 Methods of making microelectronic assemblies using bonding stage and bonding stage therefor 0 2001
6,959,489 Methods of making microelectronic packages 4 2001
6,589,819 Microelectronic packages having an array of resilient leads and methods therefor 9 2001
6,657,286 Microelectronic assembly formation with lead displacement 5 2001
6,707,149 Low cost and compliant microelectronic packages for high i/o and fine pitch 10 2001
6,690,186 Methods and structures for electronic probing arrays 22 2001
7,152,311 Enhancements in framed sheet processing 14 2001
6,885,106 Stacked microelectronic assemblies and methods of making same 28 2002
6,664,484 Components with releasable leads 11 2002
6,870,267 Off-center solder ball attach assembly 7 2002
6,709,899 Methods of making microelectronic assemblies having conductive elastomeric posts 4 2002
6,808,958 Methods of bonding microelectronic elements 4 2002
6,780,747 Methods for providing void-free layers for semiconductor assemblies 13 2002
6,847,101 Microelectronic package having a compliant layer with bumped protrusions 47 2002
6,774,317 Connection components with posts 27 2002
6,870,272 Methods of making microelectronic assemblies including compliant interfaces 27 2002
6,825,552 Connection components with anisotropic conductive material interconnection 8 2002
7,291,910 Semiconductor chip assemblies, methods of making same and components for same 12 2002
6,791,169 Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor 3 2002
7,272,888 Method of fabricating semiconductor chip assemblies 16 2002
6,856,007 High-frequency chip packages 35 2002
6,847,107 Image forming apparatus with improved transfer efficiency 14 2002
7,605,479 Stacked chip assembly with encapsulant layer 0 2002
7,566,955 High-frequency chip packages 14 2002
6,653,172 Methods for providing void-free layers for semiconductor assemblies 12 2002
6,822,320 Microelectronic connection components utilizing conductive cores and polymeric coatings 6 2002
6,723,584 Methods of making microelectronic assemblies including compliant interfaces 18 2002
6,897,565 Stacked packages 23 2002
6,750,539 Joining semiconductor units with bonding material 16 2002
7,149,095 Stacked microelectronic assemblies 31 2002
6,828,668 Flexible lead structures and methods of making same 23 2002
7,098,078 Microelectronic component and assembly having leads with offset portions 10 2002
6,888,168 Semiconductor package having light sensitive chips 8 2003
6,821,815 Method of assembling a semiconductor chip package 12 2003
6,763,579 Method of making components with releasable leads 11 2003
6,774,306 Microelectronic connections with liquid conductive elements 3 2003
6,891,255 Microelectronic packages having an array of resilient leads 8 2003
6,897,090 Method of making a compliant integrated circuit package 5 2003
6,940,158 Assemblies having stacked semiconductor chips and methods of making same 33 2003
7,012,323 Microelectronic assemblies incorporating inductors 15 2003
6,977,440 Stacked packages 29 2003
6,952,047 Assemblies having stacked semiconductor chips and methods of making same 16 2003
6,867,065 Method of making a microelectronic assembly 3 2003
6,972,495 Compliant package with conductive elastomeric posts 10 2003
7,071,547 Assemblies having stacked semiconductor chips and methods of making same 29 2003
6,927,095 Low cost and compliant microelectronic packages for high I/O and fine pitch 2 2003
7,061,122 Components, methods and assemblies for multi-chip packages 18 2003
6,921,713 Semiconductor chip package with interconnect structure 1 2003
7,098,074 Microelectronic assemblies having low profile connections 1 2003
7,176,506 High frequency chip packages with connecting elements 56 2003
7,205,659 Assemblies for temporarily connecting microelectronic elements for testing and methods therefor 1 2004
7,268,426 High-frequency chip packages 18 2004
7,754,537 Manufacture of mountable capped chips 7 2004
7,165,316 Methods for manufacturing resistors using a sacrificial layer 7 2004
7,332,068 Selective removal of dielectric materials and plating process using same 0 2004
7,114,250 Method of making components with releasable leads 8 2004
6,888,229 Connection components with frangible leads and bus 0 2004
7,112,879 Microelectronic assemblies having compliant layers 12 2004
7,166,914 Semiconductor package with heat sink 15 2004
7,091,820 Methods for manufacturing resistors using a sacrificial layer 4 2004
7,224,056 Back-face and edge interconnects for lidded package 5 2004
7,095,054 Semiconductor package having light sensitive chips 3 2004
7,462,936 Formation of circuitry with modification of feature height 2 2004
7,138,299 Method of electrically connecting a microelectronic component 19 2004
8,207,604 Microelectronic package comprising offset conductive posts on compliant layer 0 2004
7,709,968 Micro pin grid array with pin motion isolation 0 2004
7,176,043 Microelectronic packages and methods therefor 7 2004
7,521,785 Packaged systems with MRAM 4 2004
7,335,995 Microelectronic assembly having array including passive elements and interconnects 9 2005
7,453,157 Microelectronic packages and methods therefor 7 2005
7,495,179 Components with posts and pads 1 2005
7,229,850 Method of making assemblies having stacked semiconductor chips 11 2005
7,413,926 Methods of making microelectronic packages 2 2005
7,531,894 Method of electrically connecting a microelectronic component 8 2005
7,368,818 Methods of making microelectronic assemblies including compliant interfaces 7 2005
7,276,400 Methods of making microelectronic packages with conductive elastomeric posts 5 2005
7,939,934 Microelectronic packages and methods therefor 0 2005
8,067,267 Microelectronic assemblies having very fine pitch stacking 0 2005
8,058,101 Microelectronic packages and methods therefor 1 2005
8,143,095 Sequential fabrication of vertical conductive interconnects in capped chips 0 2005
7,999,379 Microelectronic assemblies having compliancy 0 2006
7,271,481 Microelectronic component and assembly having leads with offset portions 11 2006
7,454,834 Method of fabricating semiconductor chip assemblies 9 2006
7,872,344 Microelectronic assemblies having compliant layers 1 2006
7,408,260 Microelectronic assemblies having compliant layers 15 2006
7,545,029 Stack microelectronic assemblies 4 2006
7,528,008 Method of electrically connecting a microelectronic component 11 2006
7,554,206 Microelectronic packages and methods therefor 4 2006
7,749,886 Microelectronic assemblies having compliancy and methods therefor 0 2006
7,745,943 Microelectonic packages and methods therefor 1 2007
7,816,251 Formation of circuitry with modification of feature height 2 2008
8,046,912 Method of making a connection component with posts and pads 0 2009
8,114,711 Method of electrically connecting a microelectronic component 0 2009
8,148,199 Method of electrically connecting a microelectronic component 0 2009
RE43404 Methods for providing void-free layer for semiconductor assemblies 0 2010
8,093,697 Microelectronic packages and methods therefor 3 2010
8,115,308 Microelectronic assemblies having compliancy and methods therefor 0 2010
7,999,397 Microelectronic packages and methods therefor 0 2010
8,330,272 Microelectronic packages with dual or multiple-etched flip-chip connectors 0 2010
8,148,205 Method of electrically connecting a microelectronic component 0 2010
8,378,478 Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts 0 2010
8,338,925 Microelectronic assemblies having compliant layers 0 2010
8,329,581 Microelectronic packages and methods therefor 0 2011
 
NEOCONIX, INC. (16)
7,113,408 Contact grid array formed on a printed circuit board 18 2003
7,244,125 Connector for making electrical contact at semiconductor scales 30 2003
7,347,698 Deep drawn electrical contacts and method for making 3 2004
7,090,503 Interposer with compliant pins 17 2004
7,597,561 Method and system for batch forming spring elements in three dimensions 2 2005
7,383,632 Method for fabricating a connector 2 2005
7,357,644 Connector having staggered contact architecture for enhanced working range 2 2005
7,645,147 Electrical connector having a flexible sheet and one or more conductive connectors 3 2006
7,354,276 Interposer with compliant pins 7 2006
7,587,817 Method of making electrical connector on a flexible carrier 2 2006
7,628,617 Structure and process for a contact grid array formed in a circuitized substrate 2 2006
7,371,073 Contact grid array system 17 2007
7,989,945 Spring connector for making electrical contact at semiconductor scales 4 2007
7,758,351 Method and system for batch manufacturing of spring elements 5 2007
7,621,756 Contact and method for making same 3 2007
7,891,988 System and method for connecting flat flex cable with an integrated circuit, such as a camera module 1 2009
 
RENESAS ELECTRONICS CORPORATION (15)
6,342,726 Semiconductor device and manufacturing method thereof 22 1999
6,342,728 Semiconductor device and manufacturing method thereof 15 2001
6,353,255 Semiconductor device and manufacturing method thereof 3 2001
6,521,981 Semiconductor device and manufacturing method thereof 4 2001
6,355,500 Semiconductor device and manufacturing method thereof 6 2001
6,365,439 Method of manufacturing a ball grid array type semiconductor package 9 2001
6,355,975 Semiconductor device and manufacturing method thereof 2 2001
6,670,215 Semiconductor device and manufacturing method thereof 16 2002
6,664,135 Method of manufacturing a ball grid array type semiconductor package 2 2002
6,642,083 Semiconductor device and manufacturing method thereof 10 2002
7,091,620 Semiconductor device and manufacturing method thereof 7 2005
RE42972 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof 8 2005
RE43444 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes 0 2005
7,420,284 Semiconductor device and manufacturing method thereof 3 2006
RE44148 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof 0 2010
 
SEIKO EPSON CORPORATION (12)
6,323,542 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument 36 1999
6,518,651 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument 12 2001
7,235,881 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument 6 2002
7,183,189 Semiconductor device, circuit board, and electronic instrument 4 2003
7,098,125 Semiconductor device, circuit board, and electronic instrument 0 2003
7,521,796 Method of making the semiconductor device, circuit board, and electronic instrument 1 2006
7,307,351 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument 0 2007
7,485,973 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument 0 2007
7,755,205 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument 0 2008
8,384,213 Semiconductor device, circuit board, and electronic instrument 0 2009
7,888,177 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument 2 2010
8,399,999 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument 0 2011
 
TRANSPACIFIC MULTICAST, LLC (12)
6,392,428 Wafer level interposer 17 1999
6,822,469 Method for testing multiple semiconductor wafers 8 2000
6,812,048 Method for manufacturing a wafer-interposer assembly 8 2000
6,815,712 Method for selecting components for a matched set from a wafer-interposer assembly 12 2000
6,686,657 Interposer for improved handling of semiconductor wafers and method of use of same 6 2000
6,673,653 Wafer-interposer using a ceramic substrate 10 2001
6,825,678 Wafer level interposer 4 2002
6,759,741 Matched set of integrated circuit chips selected from a multi wafer-interposer 5 2003
7,036,218 Method for producing a wafer interposer for use in a wafer interposer assembly 0 2003
6,933,617 Wafer interposer assembly 2 2003
6,927,083 Method for constructing a wafer-interposer assembly 6 2004
6,967,494 Wafer-interposer assembly 6 2004
 
AMKOR TECHNOLOGY, INC. (10)
5,858,815 Semiconductor package and method for fabricating the same 48 1996
6,028,354 Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package 40 1997
6,291,884 Chip-size semiconductor packages 89 1999
6,423,576 Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package 7 1999
6,441,503 Bond wire pressure sensor die package 23 2001
6,432,737 Method for forming a flip chip pressure sensor die package 35 2001
6,661,080 Structure for backside saw cavity protection 5 2001
6,586,824 Reduced thickness packaged electronic device 15 2001
7,932,615 Electronic devices including solder bumps on compliant dielectric layers 3 2007
7,674,701 Methods of forming metal layers using multi-layer lift-off patterns 0 2007
 
MEGICA CORPORATION (10)
8,021,976 Method of wire bonding over active area of a semiconductor circuit 1 2003
8,026,588 Method of wire bonding over active area of a semiconductor circuit 0 2007
7,960,272 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging 2 2007
8,138,079 Method of wire bonding over active area of a semiconductor circuit 0 2007
8,148,806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions 1 2008
8,044,475 Chip package 1 2009
8,426,982 Structure and manufacturing method of chip scale package 0 2009
8,168,527 Semiconductor chip and method for fabricating the same 0 2009
8,334,588 Circuit component with conductive layer structure 0 2011
8,368,193 Chip package 0 2011
 
MICRON TECHNOLOGY, INC. (10)
6,455,354 Method of fabricating tape attachment chip-on-board assemblies 14 1998
6,263,566 Flexible semiconductor interconnect fabricated by backslide thinning 54 1999
6,239,489 Reinforcement of lead bonding in microelectronics packages 60 1999
7,061,119 Tape attachment chip-on-board assemblies 2 2000
6,884,653 Folded interposer 79 2001
6,406,944 Method of fabricating a reinforcement of lead bonding in microelectronic packages 1 2001
6,777,268 Method of fabricating tape attachment chip-on-board assemblies 5 2002
6,982,869 Folded interposer 10 2002
7,326,066 Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same 0 2004
7,829,385 Taped semiconductor device and method of manufacture 0 2006
 
ADVANTEST (SINGAPORE) PTE LTD (7)
7,349,223 Enhanced compliant probe card systems having improved planarity 16 2004
7,382,142 High density interconnect system having rapid fabrication cycle 6 2005
7,952,373 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies 2 2006
7,621,761 Systems for testing and packaging integrated circuits 7 2007
7,872,482 High density interconnect system having rapid fabrication cycle 0 2007
7,772,860 Massively parallel interface for electronic circuit 0 2008
7,884,634 High density interconnect system having rapid fabrication cycle 0 2009
 
FORMFACTOR, INC. (7)
5,820,014 Solder preforms 113 1996
6,274,823 Interconnection substrates with resilient contact structures on both sides 110 1996
5,994,152 Fabricating interconnects and tips using sacrificial substrates 172 1997
6,655,023 Method and apparatus for burning-in semiconductor devices in wafer form 81 1999
7,142,000 Mounting spring elements on semiconductor devices, and wafer-level testing methodology 11 2003
7,601,039 Microelectronic contact structure and method of making same 5 2006
8,033,838 Microelectronic contact structure 2 2009
 
ROUND ROCK RESEARCH, LLC (6)
6,165,817 Method of bonding a flexible polymer tape to a substrate to reduce stresses on the electrical connections 47 1999
7,019,410 Die attach material for TBGA or flexible circuitry 1 1999
6,710,456 Composite interposer for BGA packages 19 2000
7,122,908 Electronic device package 0 2001
7,071,030 Method of making a flexible substrate with a filler material 0 2003
6,770,981 Composite interposer for BGA packages 2 2003
 
INVENSAS CORPORATION (5)
8,436,457 Stub minimization for multi-die wirebond assemblies with parallel windows 0 2011
8,345,441 Stub minimization for multi-die wirebond assemblies with parallel windows 0 2011
8,404,520 Package-on-package assembly with wire bond vias 0 2012
8,436,477 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate 0 2012
8,405,207 Stub minimization for wirebond assemblies without windows 0 2012
 
QIMONDA AG (5)
6,906,928 Electronic component with a semiconductor chip, and method of producing the electronic component 4 2002
6,696,319 Method of attaching semiconductor devices on a switching device and such an attached device 2 2002
6,897,568 Electronic component with flexible contacting pads and method for producing the electronic component 11 2002
7,312,533 Electronic component with flexible contacting pads and method for producing the electronic component 6 2004
7,820,482 Method of producing an electronic component with flexible bonding 0 2005
 
TESSERA TECHNOLOGIES HUNGARY KFT. (5)
7,265,440 Methods and apparatus for packaging integrated circuit devices 17 2005
7,936,062 Wafer level chip packaging 2 2007
7,495,341 Methods and apparatus for packaging integrated circuit devices 4 2007
7,642,629 Methods and apparatus for packaging integrated circuit devices 1 2007
7,479,398 Methods and apparatus for packaging integrated circuit devices 1 2007
 
UNITED MICROELECTRONICS CORP. (5)
6,429,509 Integrated circuit with improved interconnect structure and process for making same 40 1999
6,838,310 Integrated circuit with improved interconnect structure and process for making same 7 2002
6,822,316 Integrated circuit with improved interconnect structure and process for making same 5 2002
7,030,466 Intermediate structure for making integrated circuit device and wafer 4 2003
7,179,740 Integrated circuit with improved interconnect structure and process for making same 6 2005
 
FREESCALE SEMICONDUCTOR, INC. (4)
5,714,800 Integrated circuit assembly having a stepped interposer and method 45 1996
6,064,114 Semiconductor device having a sub-chip-scale package structure and method for forming same 71 1997
6,294,405 Method of forming semiconductor device having a sub-chip-scale package structure 18 2000
7,927,927 Semiconductor package and method therefor 1 2001
 
TEXAS INSTRUMENTS INCORPORATED (4)
6,544,816 Method of encapsulating thin semiconductor chip-scale packages 6 1999
6,762,506 Assembly of semiconductor device and wiring substrate 6 2003
7,294,929 Solder ball pad structure 22 2003
6,998,297 Wafer level packaging 0 2004
 
DOW CORNING CORPORATION (3)
7,074,481 Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes 5 2001
6,784,555 Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes 9 2001
6,793,759 Method for creating adhesion during fabrication of electronic devices 7 2001
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
6,946,329 Methods of making and using a floating interposer 1 2004
7,514,276 Aligning stacked chips using resistance assistance 1 2008
8,432,034 Use of a local constraint to enhance attachment of an IC device to a mounting platform 0 2011
 
NEC CORPORATION (3)
5,805,422 Semiconductor package with flexible board and method of fabricating the same 133 1997
6,803,647 Mounting structure of semiconductor device and mounting method thereof 1 2001
6,958,262 Mounting structure of semiconductor device and mounting method thereof 0 2004
 
ATMEL CORPORATION (2)
5,367,763 TAB testing of area array interconnected chips 29 1993
5,612,514 Tab test device for area array interconnected chips 4 1994
 
FUJITSU LIMITED (2)
5,404,265 Interconnect capacitors 47 1992
6,050,832 Chip and board stress relief interposer 86 1998
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
6,372,547 Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board 17 1998
6,365,499 Chip carrier and method of manufacturing and mounting the same 14 2000
 
NANONEXUS CORPORATION (2)
7,579,848 High density interconnect system for IC packages and interconnect assemblies 10 2006
7,403,029 Massively parallel interface for electronic circuit 6 2006
 
RENESAS TECHNOLOGY CORP. (2)
RE41721 Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes 8 2000
RE41722 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof 8 2002
 
ROHM CO., LTD. (2)
6,133,637 Semiconductor device having a plurality of semiconductor chips 148 1998
6,458,609 Semiconductor device and method for manufacturing thereof 9 2000
 
SILICON LABORATORIES INC. (2)
6,323,735 Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors 67 2000
6,903,617 Method and apparatus for synthesizing high-frequency signals for wireless communications 3 2002
 
THOMAS & BETTS INTERNATIONAL, INC. (2)
5,599,193 Resilient electrical interconnect 49 1994
5,949,029 Conductive elastomers and methods for fabricating the same 16 1996
 
W. L. GORE & ASSOCIATES, INC. (2)
6,377,475 Removable electromagnetic interference shield 21 2001
6,744,640 Board-level EMI shield with enhanced thermal dissipation 25 2002
 
3M INNOVATIVE PROPERTIES COMPANY (1)
5,990,545 Chip scale ball grid array for integrated circuit package 115 1996
 
ADVANCED TECHNOLOGY INTERCONNECT INCORPORATED (1)
6,262,477 Ball grid array electronic package 25 1993
 
AGERE SYSTEMS INC. (1)
6,830,999 Method of fabricating flip chip semiconductor device utilizing polymer layer for reducing thermal expansion coefficient differential 0 2002
 
AGILENT TECHNOLOGIES, INC. (1)
6,538,207 Strain relief structures for lead connections 3 2002
 
AMKOR TECHNOLOGY KOREA, INC. (1)
5,977,624 Semiconductor package and assembly for fabricating the same 19 1998
 
AXALTO SA (1)
5,640,306 Contactless smart card the electronic circuit of which comprises a module 21 1995
 
CITIZEN HOLDINGS CO., LTD. (1)
6,077,382 Mounting method of semiconductor chip 32 1998
 
COLIBRYS SA (1)
6,124,631 Micro sensor and method for making same 26 1997
 
COMPUTING DEVICES INTERNATIONAL, INC. (1)
6,000,126 Method and apparatus for connecting area grid arrays to printed wire board 3 1996
 
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. (1)
8,198,739 Semi-conductor chip with compressible contact structure and electronic package utilizing same 0 2010
 
HAMILTON SUNDSTRAND CORPORATION (1)
7,982,137 Circuit board with an attached die and intermediate interposer 0 2007
 
HEWLETT-PACKARD COMPANY (1)
5,468,994 High pin count package for semiconductor device 22 1992
 
HITAHI MICROCOMPUTER SYSTEM, LTD (1)
6,472,727 Semiconductor device and manufacturing method thereof 13 2001
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (1)
7,070,831 Member for semiconductor package and semiconductor package using the same, and fabrication method thereof 0 2002
 
LG SEMICON CO., LTD. (1)
5,990,563 Semiconductor package having a connection member 11 1996
 
LUCENT TECHNOLOGIES INC. (1)
6,441,473 Flip chip semiconductor device 14 2000
 
MINNESOTA MINING AND MANUFACTURING COMPANY (1)
5,635,718 Multi-module radiation detecting device and fabrication method 40 1996
 
MURATA MANUFACTURING CO., LTD. (1)
6,815,834 Electronic part 1 2003
 
NORTHFIELD ACQUISITION CO. (1)
5,840,402 Metallized laminate material having ordered distribution of conductive through holes 21 1994
 
PACTECH PACKAGING TECHNOLOGIES GMBH (1)
6,093,971 Chip module with conductor paths on the chip bonding side of a chip carrier 12 1997
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (1)
6,372,526 Method of manufacturing semiconductor components 1 1998
 
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (1)
8,058,145 Micro-electro-mechanical device and manufacturing method for the same 0 2010
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
6,150,194 Semiconductor device sealed with resin, and its manufacture 16 1998
 
TECHNOLOGY IP HOLDINGS (1)
6,436,735 Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact 6 2000
 
TESSERS, INC. (1)
6,699,730 Stacked microelectronic assembly and method therefor 106 2001
 
UNIVERSITY OF SOUTHERN CALIFORNIA (1)
5,633,785 Integrated circuit component package with integral passive component 55 1994
 
VIRTUAL INTEGRATION, INC. (1)
6,294,407 Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same 49 1999
 
WESTERN DIGITAL (FREMONT), INC. (1)
5,973,391 Interposer with embedded circuitry and method for using the same to package microelectronic units 47 1997
 
WHITAKER CORPORATION, THE (1)
6,394,819 Dielectric member for absorbing thermal expansion and contraction at electrical interfaces 20 1998
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (2)
7,625,220 System for connecting a camera module, or like device, using flat flex cables 1 2006
8,441,111 Stub minimization for multi-die wirebond assemblies with parallel windows 0 2012