Method for heat-processing semiconductor device and apparatus for the same
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United States of America Patent
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Sep 29, 1992
Grant Date -
N/A
app pub date -
Jun 15, 1990
filing date -
Jun 16, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
CPU stores information showing a time-temperature relationship and applicable for either heating a semiconductor wafer to a hold temperature for a predetermined period of time or cooling the wafer from the hold temperature over a predetermined period of time, or for both, read the information. A conductive thin film heats the wafer in accordance with the information. A sensor detects the temperature of the wafer. A control system controls either the heating of the wafer or the cooling thereof, or both, in accordance with the detected temperature signal and the information.
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