Method and structure for repairing electrical lines
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United States of America Patent
Stats
-
Oct 6, 1992
Grant Date -
N/A
app pub date -
Oct 31, 1990
filing date -
Oct 31, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates generally to a new method of repairing electrical lines, and more praticularly to repairing electrical lines having an open at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the open with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.
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