Method for bonding or potting substrates
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United States of America Patent
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Oct 13, 1992
Grant Date -
N/A
app pub date -
Mar 22, 1990
filing date -
Mar 23, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for bonding or potting substrates by means of cationically polymerizable masses being activated before joining or potting by irradiation with visible light and curing after joining or potting of the substrates without the irradiation being continued is described as well as an apparatus for executing this method. By irradiation with light having a wavelength of from 400 to 600 nm for photo-activation of said masses, a prolonged pot life of said masses without reducing their wetting ability during pot life is obtained such that the masses are unlimitedly applicable for more than 30, preferably more than 100 sec. after exposure is finished. The apparatus according to the invention comprises a source of irradiation which exclusively emits light having a wavelength of >400 nm.
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