Film thickness uniformity control apparatus for in-line sputtering systems
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United States of America Patent
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Oct 20, 1992
Grant Date -
N/A
app pub date -
Oct 12, 1990
filing date -
Oct 12, 1990
priority date (Note) -
Expired
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Abstract
A mask arrangement is located between the cathode and substrate in an in-line sputtering system. The relative shape of the mask may be changed from outside the system. Thus, film thickness uniformity can be modified and controlled without interrupting the sputtering process.
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