Rotary sputtering cathode
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United States of America Patent
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Oct 27, 1992
Grant Date -
N/A
app pub date -
Jun 10, 1991
filing date -
Jun 8, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A vacuum sputtering cathode has a hollow structure (2) able to rotate about its axis and a magnetic confinement circuit (3) arranged peripherally about said structure. The cathode according to the invention is particularly suitable for the rapid dissipation of the thermal energy given off by the sputtering process and in particular for the sputtering of metals with a low melting point.
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