Semiconductor device having a particular chip pad structure
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United States of America Patent
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Oct 27, 1992
Grant Date -
N/A
app pub date -
Feb 1, 1991
filing date -
Feb 1, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An encapsulated semiconductor device has a chip, a chip pad having through holes and also conducting patterns corresponding to an electrode pad of the chip, and leads. An arbitrary external terminal arrangement is obtained by combining a wire bonding operation between the conduting pattern and lead. Wire bonding is advantageously performed between the leads and electrode pads of the semiconductor chip arranged at arbitrary positions. The degree of freedom in designing areas of the chips and also a printed circuit board is improved so that a high packaging density is achieved and furthermore the printed circuit board is made compact.
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