Printed circuit board having an integrated decoupling capacitive element
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United States of America Patent
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Nov 10, 1992
Grant Date -
N/A
app pub date -
Aug 27, 1991
filing date -
Aug 27, 1991
priority date (Note) -
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Abstract
A printed circuit board is disclosed which includes a high capacitance power distribution core, the manufacture of which is compatible with standard printed circuit board assembly technology. The high capacitance core consists of a ground plane and a power plane separated by a planar element having a high dielectric constant. The high dielectric constant material is typically glass fiber impregnated with a bonding material, such as epoxy resin loaded with a ferro-electric ceramic substance having a high dielectric constant. The ferro-electric ceramic substance is typically a nanopowder combined with an epoxy bonding material. The resulting capacitance of the power distribution core is typically sufficient to totally eliminate the need for decoupling capacitors on a typical printed circuit board.
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