Method of using copper(II) containing compounds to accelerate wound healing

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United States of America Patent

PATENT NO 5164367
SERIAL NO

07499606

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Abstract

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Methods for the use of compositions of copper(II) containing compounds to accelerate healing of wounds in warm-blooded animals. The methods include systemic loading of copper(II) to accelerate the rate of wound healing following injury or surgery. The copper(II) containing compounds include copper(II) complexes with amino acids and peptides, and copper(II) salts.

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Patent Owner(s)

Patent OwnerAddress
PROCYTE CORPORATION2893 - 152ND AVENUE N E REDMOND WA 98052 U S A

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pickart, Loren R Bellevue, WA 27 868

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