Post-termination apparatus and process for thick film resistors of printed circuit boards
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United States of America Patent
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Nov 17, 1992
Issued Date -
N/A
app pub date -
Jul 1, 1991
filing date -
Oct 11, 1988
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board includes both high and low resistive value thick film resistors interconnected by a copper film. To lower the contact resistance to the thick film resistors of high value, each is provided at its ends with a termination of a composition similar to that used for the low value resistors. This provides a relatively low resistance contact region which overcomes the difficulty that a copper thick film conductor has in making electrical connections to compositions generally used for making high value thick film resistors. The composition of high and low resistivities are adapted to permit firing of both compositions in a single firing step.
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