Transfer molded semiconductor device package with integral shield
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United States of America Patent
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-
Nov 24, 1992
Grant Date -
N/A
app pub date -
Feb 22, 1991
filing date -
Feb 22, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a substrate (10) having a metallization pattern (12, 13), with one portion of the metallization pattern being a circuit ground (13). A semiconductor device (16) is electrically interconnected (17) to the metallization pattern (12). A perforated metal shield or screen (18) covers the semiconductor device (16) and is electrically and mechanically attached to the metallization circuit ground (13) in order to shield the semiconductor device (16) from radio frequency energy. A resin material (14) is transfer molded about the semiconductor device, the electrical interconnections, and the metal screen to form the completed package.
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