Apparatus for manufacturing interconnects with fine lines and fine spacing
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United States of America Patent
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Dec 1, 1992
Issued Date -
N/A
app pub date -
May 17, 1991
filing date -
Feb 15, 1989
priority date (Note) -
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Abstract
An apparatus for producing fine line printed circuits, with fine spacing between lines, includes a pad structure which can be vibratedly moved across the surface of a laminate to be etched. Etchant solution is provided in a uniform manner across the face of the pad structure as a result of the combination of the layout of the face of the pad, the support materials, and the orientation of an etchant distribution system.
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