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Abstract

A method of making fully dense, crack-free silicon nitride articles using polysilanes as a binder. Polysilane is dissolved in a solvent and a silicon nitride composition including a densification aid is added to form a homogeneous mixture. The mixture is dried to form a powder, and molded at a temperature less than 100.degree. C. to form a molded article. Alternatively, the slurry is poured into a mold and vacuum filtered to form a cake, then isostatically pressed at a temperature of approximately 90.degree. C. The molded article or pressed cake is heated at a rate of approximately 5.degree. C./min to about 900.degree. C. in a nonoxidizing atmosphere and held at about 900.degree. C. for a time sufficient to decompose the polysilane. The article is sintered in a nonoxidizing atmosphere at a temperature of about 1685.degree.-1900.degree. C. to form a silicon nitride article free of cracks and having a density greater than 3.5 g/cc.

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