Formation of high quality patterns for substrates and apparatus therefor
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United States of America Patent
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Dec 1, 1992
Issued Date -
N/A
app pub date -
Oct 30, 1989
filing date -
Oct 30, 1989
priority date (Note) -
Expired
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Abstract
An apparatus and method for accurately and rapidly machining a workpiece, particularly for drilling holes smaller than can be formed by other methods, by using a high power pulsed Nd:YAG laser. A low power HeNe laser is joined to the optical path of the high power laser. The colinear beams then scan along one axis of the workpiece. The low power beam is partially split off to a location determining device before final deflection to the workpiece. Deflection in a second axis is achieved by linearly moving the workpiece so that the beam will impinge upon the desired location of the workpiece.
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