Method of manufacturing printed wiring board
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United States of America Patent
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-
Dec 8, 1992
Grant Date -
N/A
app pub date -
Mar 15, 1991
filing date -
Jul 18, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a printed wiring board on a cubically molded substrate enables formation of high-precision printed circuits fully compatible with the complex configuration of the cubic substrate. The manufacturing method includes initially forming a conductive layer on the surface of a cubic substrate followed by etching the conductive layer. The method includes the steps of forming electrodeposited resist on the conductive layer, exposing the electrodeposited resist to parallel light beams through a planar photomask, and etching the conductive layer to complete the formation of the printed circuit.
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