Heat sink design integrating interface material
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United States of America Patent
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-
Dec 8, 1992
Grant Date -
N/A
app pub date -
Sep 25, 1991
filing date -
Sep 25, 1991
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method and assembly for a heat sink that is attached to a chip carrier. The heat sink has a plurality of fins extending from the first surface of a plate and a pair of rails extending from a second opposite surface of the plate. The rails are constructed to contain and restrain the heat sink on the chip carrier. The heat sink also has a recess and a pair of support surfaces between the rails. To attach the chip carrier to the heat sink, a thermally conductive adhesive is applied into the center of the recess. The chip carrier is then placed on the support surfaces between the rails. Mounting the carrier on the support surface pushes the adhesive throughout the recess. The adhesive cures at room temperature, wherein the heat sink is bonded to the chip carrier.
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