Method for soldering and apparatus therefor
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United States of America Patent
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-
Dec 8, 1992
Issued Date -
N/A
app pub date -
Sep 30, 1991
filing date -
Aug 10, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.
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Cited Art Landscape
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