Non-contact pick-up head
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United States of America Patent
Stats
-
Dec 8, 1992
Grant Date -
N/A
app pub date -
Jun 17, 1991
filing date -
Jun 17, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A pick-up tool or pick-up head is provided for picking up semiconductor objects. The active face of the pick-up tool is provided with an outer plenum which extends around the peripheral edges of the object to be picked up and further includes an inner plenum formed in the center of the pick-up tool over the object to be picked up. A partial vacuum is applied to the inner plenum and compressed air is supplied to the outer plenum which flows over a support ridge separating the inner plenum from the outer plenum. The air flowing over the ridge generates a thin air film supporting layer so that the object being picked up by the pick-up tool is supported on the air film and levitated separate and apart from the pick-up tool.
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