Apparatus for wafer processing with in situ rinse
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United States of America Patent
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-
Dec 8, 1992
Grant Date -
N/A
app pub date -
Jan 26, 1990
filing date -
Jan 26, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wafer processing apparatus including a head defining an etching chamber, the sidewall of the head being slidable along the base so that the sidewall and base will normally define an etch chamber; and the sidewall may be moved upwardly to open a discharge passage for rinsing water, and a deflecting surface for deflecting the rinsing water downwardly and draining the rinsing water from the passage. The housing is separable above the deflector ring to provide access to the wafer for inserting the wafer and replacing it.
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