Joining method
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United States of America Patent
Stats
-
Dec 8, 1992
Grant Date -
N/A
app pub date -
Nov 4, 1991
filing date -
May 5, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of joining a covering layer (9) onto a substrate (10) comprises placing part of the covering layer (9) on the substrate (10) with the remaining part of the covering layer spaced from the substrate so as to expose a region of contact (5) between the covering layer and substrate. A focussed power beam such as a laser or electron beam impinges on the contact region (5) so as to bond or fuse the substrate (10) and covering layer (9) together. The spaced part of the covering layer (9) is then moved towards the substrate (10) so as to change the position of the contact region (5) and the focussed power beam is caused to impinge on the new contact region. These steps are repeated until the covering layer is bonded or fused to the substrate.
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