Liquid metal paste for thermal and electrical connections
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United States of America Patent
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Dec 15, 1992
Grant Date -
N/A
app pub date -
Nov 14, 1991
filing date -
Nov 14, 1991
priority date (Note) -
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Abstract
A thermally and electrically conductive paste for making a detachable and compliant connection between two surfaces. The paste comprises an equilibrium mixture of an electrically conductive liquid metal and particulate solid constituents, wherein at the temperature of the paste during connection the proportions of liquid metal and particulate solid constituents remain between the ultimate liquidus and the ultimate solidus of the phase diagram of the mixture and the paste remains non-solidified. in cryogenic and low temperature environments the paste forms a hardened bond with a TCE matched to a contacted surface.
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