Importance

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Abstract

In IC test equipment in which an IC element sucked by an air chuck is carried in the horizontal direction by an X-Y transport unit and the air chuck is lowered toward a test head to load the IC element onto a socket provided on a performance board for test, the socket has a contact housing room defined by a bottom panel and a surrounding wall raised about the periphery thereof, in which spring contacts are arranged, and a planar heat cap made of metal is placed on the socket. In a hole made in the heat cap there are buried a heater and a temperature sensor. The heat cap has a centrally-disposed through hole for receiving the IC element. The through hole is closed to shield the contact housing room from the outside when the air chuck is brought down to the socket.

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First Claim