Micromachined semiconductor probe card
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United States of America Patent
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Dec 15, 1992
Grant Date -
N/A
app pub date -
Feb 15, 1991
filing date -
Feb 15, 1991
priority date (Note) -
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Abstract
A semiconductor probe card having a plurality of micromachined probes tips for contacting an array of electrode pads formed on a semiconductor integrated circuit is provided. The plurality of probe tips are formed on the top surface of the substrate wherein the probe tips are arranged in an array matching of electrode pads on the integrated circuit to be tested. A portion of the semiconductor substrate underneath the probe tips is thin, so that the probe tips rests on a flexible diaphragm or beam.
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