Leadless semiconductor device and method for making the same
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United States of America Patent
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Dec 15, 1992
Issued Date -
N/A
app pub date -
Apr 10, 1992
filing date -
Feb 6, 1991
priority date (Note) -
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Abstract
A semiconductor device having a thin package profile is leadless, thereby minimizing necessary mounting space on a substrate. In one form, a semiconductor device has a semiconductor die electrically coupled to a plurality of conductive leads. Each lead has a first portion, a second portion, and an intermediate portion which separates the first and second portions. A package body encapsulates the semiconductor die and the first and intermediate portions of the leads. The second portions of the leads are exposed on the bottom surface of the package body and are used to electrically access the semiconductor die.
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