Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device
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United States of America Patent
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Dec 22, 1992
Grant Date -
N/A
app pub date -
Sep 17, 1991
filing date -
Sep 20, 1990
priority date (Note) -
Expired
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Abstract
A bump electrode having a protrusion is formed. The protrusion is made of a folded wire whose tail is bonded to a cavity on the base of the bump electrode. A method of manufacturing a resin-sealed semiconductor device encapsulating a chip equipped with bump electrodes is also presented.
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