Semiconductor device having a particular lid means and encapsulant to reduce die stress
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United States of America Patent
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Dec 22, 1992
Grant Date -
N/A
app pub date -
Apr 8, 1991
filing date -
Apr 8, 1991
priority date (Note) -
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Abstract
A semiconductor device (20) has reduced die stress by incorporating a lid (30) which constrains the expansion and contraction of an encapsulant. In one embodiment, a semiconductor die (22) having an active surface (23) is coupled to a plurality of leads (24). An encapsulant (28) is disposed on the active surface. The lid (30) overlies the active surface (23) and is adhesively coupled to the semiconductor die (22) by the encapsulant (28). The lid is of a material which has a coefficient of thermal expansion which closely approximates that of the semiconductor die in order to prevent stress build-up in the die which is normally caused by higher rates of expansion and contraction of the encapsulant in comparison to the those of the semiconductor die.
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