Molded IC card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 22, 1992
Grant Date -
N/A
app pub date -
Apr 25, 1991
filing date -
May 7, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC card includes a thin plate forming an external surface of the card, a circuit board formed on an internal surface of the thin plate, and a frame surrounding peripheries of the thin plate and the circuit board. A space defined by the frame and the surface plate is filled with molded resin. A portion of an inner peripheral surface of the frame projects into the resin. The molded resin completely covers a surface of the circuit board and integrates the frame and the thin plate.
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