Double chamber vacuum apparatus for thin layer deposition
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United States of America Patent
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-
Dec 29, 1992
Issued Date -
N/A
app pub date -
Apr 3, 1992
filing date -
Jul 26, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for thin layer vapor deposition has two horizontally spaced apart vacuum deposition chambers. Rearwardly and inwardly angled horizontal vacuum ducts are connected to the chambers, and a vacuum pumping device is connected to a further horizontal vacuum duct which communicates with the inwardly angled ducts. A computerized central system disposed between the chambers is operatively connected to the ducts and vacuum pumping device to enable either of the chambers to be used for set-up and evacuation while the other chamber is used for heating and deposition.
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