Process for the production of a circuit arrangement on a support film
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United States of America Patent
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-
Dec 29, 1992
Issued Date -
N/A
app pub date -
Mar 8, 1991
filing date -
Oct 20, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The circuit arrangement has at least one electrically conductive cut conductor track on at least one surface of a support film, the support film being free of deformations and fluctuations in the thickness, both in the region of the conductor track covering it and outside this region. The edges of the conductor track have a projection in the form of a stamping burr. A negative circuit is applied to a stamping substrate or embossed in the latter by means of embossing dies or punching tools constituting a block; the conductor track representing the remaining positive circuit is transferred to the support film.
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