Device for testing adhesive bonds
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United States of America Patent
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-
Jan 5, 1993
Grant Date -
N/A
app pub date -
Oct 1, 1990
filing date -
Oct 1, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An adhesive is applied to overlapping portions of a two-part test sample located between opposing press heads of the bond testing device. The press heads then press together the overlapping portions for a specific period of time while heating the test sample to a preselected temperature. The device precisely maintains the temperature while bonding the sample at a preselected pressure. A load cell measures the shear force required to separate the bonded test piece.
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Cited Art Landscape
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