Importance

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Abstract

Modular socket technology is disclosed, which includes a contact board mounted to an electronic device for receiving voltage and current signals to be transmitted from the electronic device to a semiconductor circuit. A compression coupler is provided for receiving the semiconductor circuit. The compression coupler includes a printed circuit board having a plurality of conductors mounted to a first side thereof, and extending to a second side thereof for providing electrical contact between the leads of the semiconductor circuit and the contact board. The contact board further includes a resilient conductor adapted to mechanically and electrically engage the plurality of conductors of the compression coupler, thereby to couple voltage and current signals from the electronic device to the semiconductor circuit. The modular socket apparatus may further include a semiconductor carrier for receiving the semiconductor circuit. The compression coupler includes an elastic conductor for conducting voltage and current signals from the plurality of conductors to the leads of the semiconductor circuit. The semiconductor carrier includes a compression pad for engaging the semiconductor circuit to compress the leads of the semiconductor circuit to the elastic conductor, thereby to make mechanical and electrical contact between the leads of the semiconductor circuit and the elastic conductor so that voltage and current signals may be transmitted from the leads of the semiconductor circuit to the electronic device.

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First Claim