Silicon-on-silicon differential input sensors
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United States of America Patent
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Jan 12, 1993
Grant Date -
N/A
app pub date -
Jul 22, 1991
filing date -
Jul 22, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved diaphragm sensor employs silicon-on-silicon technology and has monolithic integrated signal conditioning circuitry. The support circuitry minimizes the effects of stray capacitance and may be configured to provide either analog or digital output to external terminals. It has a wide band of linearity and is particularly useful for accurately measuring pressures less than 0.5 PSI. The sensor is constructed by joining a silicon top plate having a mechanical pressure stop, a reduced thickness silicon diaphragm and a back plate having CMOS circuitry thereon. These components are bonded together by eutectic soldering.
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