Pattern forming and transferring processes
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United States of America Patent
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Jan 12, 1993
Grant Date -
N/A
app pub date -
Jul 21, 1989
filing date -
Jul 21, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Pattern forming and transferring processes using radiation sensitive materials based upon mixtures of polyoxometalates and organic compounds. The processes involve establishing a layer of such radiation sensitve material on one or more layers of underlying materials. A pattern is formed in the layer of radiation sensitive material by exposing selected areas of the layer to radiation. The pattern may then be transferred into the underlying layers of material. Methods for developing patterns in layers of radiation sensitive materials, so as to hinder leaching of etch resistant substances included in the radiation sensitive materials, are also provided.
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