Etching method of forming microcircuit patterns on a printed circuit board
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United States of America Patent
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Jan 19, 1993
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N/A
app pub date -
Jul 22, 1991
filing date -
Jul 22, 1991
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Abstract
An etching method of forming circuit patterns on a printed circuit board is disclosed. The etching method comprises step of supplying etching solvent with discharge pressure of substantially 5.about.10 kg/cm.sup.2 and discharge particle diameter of 100.about.200 .mu.m.
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