Compound semiconductor pellet, and method for dicing compound semiconductor wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 26, 1993
Issued Date -
N/A
app pub date -
Oct 7, 1991
filing date -
Aug 2, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A compound semiconductor pellet has a zincblende crystal structure and is formed of a III-V compound semiconductor, such as GaAs. The major surface of the pellet and side surfaces thereof are both {100} planes. To obtain this type of pellet, [010] and [001] directions are selected as dicing directions. In the case of a crystal having a zincblende crystal structure, a direction which forms 45.degree. with reference to a cleavage plane of the crystal is selected as a dicing direction.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully