Plasma processing method and apparatus using electron cyclotron resonance

United States of America Patent

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Jan 26, 1993
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N/A
app pub date
Nov 29, 1990
filing date
Nov 29, 1989

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Expired

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Abstract

In a plasma processing apparatus using ECR, faces in contact with plasma excepting a substance to be processed are covered by an insulating material. By such configuration, discharge caused between the plasma and the substance to be processed in plasma processing is prevented beforehand.

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Patent Owner(s)

Patent Owner	Address
HITACHI LTD	6-6 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 100-8280

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H05H:PLASMA TECHNIQUE

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Fukuda, Takuya	Hitachi, JP	83	1052
Ohue, Michio	Hitachi, JP	17	297
Sonobe, Tadasi	Iwaki, JP	16	351

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Plasma processing method and apparatus using electron cyclotron resonance

Number of patents in Portfolio can not be more than 2000

United States of America Patent

07619338

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PATENT NO	5182495
SERIAL NO	07619338
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07619338

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