Semiconductor device
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United States of America Patent
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-
Feb 2, 1993
Issued Date -
N/A
app pub date -
Jan 14, 1991
filing date -
Jun 30, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.
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