High power, high density interconnect apparatus for integrated circuits
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United States of America Patent
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Feb 9, 1993
Issued Date -
N/A
app pub date -
Oct 16, 1990
filing date -
Dec 1, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides an improved method for manufacturing circuit boards with high power, high density interconnects. Printed circuit board technology, integrated circuit technology, and heavy-build electroless plating are combined to produce multilayer circuit boards comprised of substrates with different interconnect densities. In the higher density substrates, thick metallized layers are built-up by combining additive and subtractive techniques. These thicker foils minimize DC voltage drop so that conductors can run for longer distances. The conductors are substantially more square than their thin film equivalents, thus providing better performance for high frequency signals. Power distribution capabilities are enhanced by the present invention, so that circuit boards fully populated with dense, high-speed, high-power integrated circuits can easily be supplied with their necessary power requirements.
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